射频电缆组件组装工艺浅谈

近年来国内外射频电缆组件的发展很快,射频电缆组件的性能不断提高,对射频电缆组件组装工艺也提出了更高的要求.射频电缆组件组装过程多是手工操作,产品的一致性及性能很难控制,要求有良好的工艺保证,为此介绍了射频电缆组件组装工艺,包括电缆的裁剪及剥皮、内导体的连接、外导体的连接和电气性能的测试;探讨了在组装过程中应注意的问题,以及针对内导体焊接易出现虚焊问题进行研究.     

多晶硅衬底上的RF MEMS开关

在微机械开关与硅IC工艺设计和兼容方面进行了改进,获得了一种可与IC工艺兼容的RFMEMS微机械开关.采用介质隔离工艺技术把这种RFMEMS微机械开关制作在绝缘的多晶硅衬底上,实现了与IC工艺兼容;采用在金属膜桥的端点附近刻蚀一些孔的优化方法,降低了RFMEMS微机械开关的下拉电压.用TE2 819电容测试设备测试开关的电容,测得开关的开态电容、关态电容和致动电压分别为0 32 pF、6 pF和2 5V .用HP875 3C网络分析仪对RFMEMS微机械开关进行了RF特性测试,得出RFMEMS微机械开关在频率1 5GHz下关态的隔离度为35dB ,开态的插入损耗为2dB ,用示波器测得该开关的开关     

二氧化锡溅射工艺研究

SnO2 是最早使用也是目前使用最广泛的一种气敏材料 ,使用该材料设计制作的气敏传感器具有许多优点。在简要介绍溅射镀膜的成膜过程和特点的基础上 ,着重介绍了SnO2 膜的制备流程 ,分析了功率和温度变化对成膜质量的影响     

射频板条CO_2激光器并联谐振技术的研究

本文利用周期性网络模型计算了射频板条CO2激光器电极的纵向电压分布．探讨了并联谐振技术在板条器件中获得成功运用的原因．提出了利用并联谐振技术进一步提高电压分布均匀性的两个途径．     

NdFeB永磁靶材溅射模拟

运用SRIM2006软件对Nd2Fe14B靶溅射过程进行了模拟,并就入射离子的入射能量和角度进行了分析,得到溅射产额与入射离子能量、入射角度以及溅射靶材的一般规律:1)溅射产额随着入射离子能量的增加而增加,在低能量区域增加很快,到了高能量区域增加变缓;2)溅射产额随着入射离子入射角度的增大逐渐增大,且在70°~80°出现极大值,如当入射离子的入射角度为75°,入射离子能量为7 keV时,溅射产额可达4.398(原子.离子–1);3)溅射原子的摩尔比与靶材原子摩尔比存在一定偏差,导致薄膜成分与靶材成分不一致。     

Pool boiling on a superhydrophilic surface

Titanium Dioxide, TiO₂, is a photocatalyst with a unique characteristic. A surface coated with TiO₂ exhibits an extremely high affinity for water when exposed to UV light and the contact angle decreases nearly to zero. Inversely, the contact angle increases when the surface is shielded from UV. This superhydrophilic nature gives a self-cleaning effect to the coated surface and has already been applied to some construction materials, car coatings and so on. We applied this property to the enhancement of boiling heat transfer. An experiment involving the pool boiling of pure water has been performed to make clear the effect of high wettability on heat transfer characteristics. The heat transfer surface is a vertical copper cylinder of 17 mm in diameter and the measurement has been done at saturated temperature and in a steady state. Both TiO₂-coated and non-coated surfaces were used for comparison. In the case of the TiO₂-coated surface, it is exposed to UV light for a few hours before experiment and it is found that the maximum heat flux (CHF) is about two times larger than that of the uncoated surface. The temperature at minimum heat flux (MHF) for the superhydrophilic surface is higher by 100 K than that for the normal one. The superhydrophilic surface can be an ideal heat transfer surface. Copyright © 2002 John Wiley & Sons, Ltd.     

InxGa1−xAs ohmic contacts to n-type GaAs with a tungsten nitride barrier

Significant reduction of the contact resistance of In_0.7Ga_0.3As/Ni/W contacts (which were previously developed by sputtering in our laboratory) was achieved by depositing a W₂N barrier layer between the Ni layer and W layer. The In_0.7Ga_0.3 As/Ni/W₂N/W contact prepared by the radio-frequency sputtering technique showed the lowest contact resistance of 0.2 Ωmm after annealing at 550°C for 10 s. This contact also provided a smooth surface, good reproducibility, and excellent thermal stability at 400°C. The polycrystalline W₂N layer was found to suppress the In diffusion to the contact surface, leading to improvement of the surface morphology and an increase in the total area of the In_xGa−As between metal and the GaAs substrate. These improvements are believed to reduce the contact resistance.     

高效率平面磁控溅射器的研制

介绍一种新型磁控溅射装置。它采用两块极性相对的环状磁铁的设计方法，通过扩大靶表面的等离子放电区域面积，使传统磁控溅射枪使用中经常受到的两个限制──溅射速率与靶的利用率得到了较大的改善。实验中铜靶在溅射功率密度为11W／cm~2时溅射速率约为800nm／min，如果继续提高功率则可获得更高的速率。而靶的利用率可达64％左右。另外，在认为出射粒子符合cos~nθ分布的前提下，发现当n＝3．3时，实验数据和理论数据符合得较好。     

小型RFCO2激光器的电路保护

本文详细分析研究了小型射频CO2激光器经常出现的故障现象(过压、负载短路故障),并介绍了相应的保护措施,对实际工作有显着指导意义。